Why is Low Sodium Type Colloidal Silica/Silica Sol so good at bonding?

In the vast field of materials science, Low Sodium Type Colloidal Silica/Silica Sol stands out for its bonding and is an indispensable key material in many industrial applications. So why does this colloidal solution have such good bonding properties?

Colloidal silica is formed by tiny silica particles evenly dispersed in water. These particles are extremely small, usually at the nanometer level, so they have a very high specific surface area. This high specific surface area means that the particle surface has a large number of active sites, which can interact strongly with the surrounding medium, thus giving the colloidal solution good physical and chemical properties.

In terms of bonding, the reason why low sodium type colloidal silica performs well is mainly due to its unique chemical properties and interactions between particles. On the one hand, the surface of silica particles in the colloid is rich in hydroxyl (-OH) groups, which are easy to form hydrogen bonds with hydroxyl or polar groups on the surface of other substances in aqueous solution. Hydrogen bonds are a strong intermolecular force that can firmly connect the colloidal particles to the surface of the material to be bonded to form a stable bonding layer. On the other hand, as the water evaporates, the silica particles in the colloidal silica will gradually approach and contact each other. In this process, the hydroxyl groups on the surface of the particles will further undergo condensation reactions to form silicon-oxygen bonds (Si-O-Si). Silicon-oxygen bonds are extremely strong chemical bonds, and their bond energy is much higher than that of hydrogen bonds. Therefore, they can significantly improve the strength and stability of the bonding layer. This transition from hydrogen bonds to silicon-oxygen bonds is the key to enhancing the bonding of low-sodium colloidal silica.

In addition, the content of sodium ions is strictly controlled during the preparation of low-sodium colloidal silica. As an electrolyte, sodium ions may destroy the double-layer structure on the surface of colloidal particles at high concentrations, causing particle coagulation and affecting bonding performance. Therefore, by reducing the sodium ion content, the stable dispersion state of the colloidal particles can be maintained, thereby further improving their bonding.

The good bonding of Low Sodium Type Colloidal Silica/Silica Sol is mainly due to its nano-scale particle size, high specific surface area, abundant hydroxyl groups and the formation of silicon-oxygen bonds. The combined effect of these factors enables colloidal silica to form a strong and stable bonding layer on the surface of a variety of materials, and is widely used in refractory materials, coatings, precision casting, papermaking and other fields. With the advancement of science and technology and the continuous optimization of processes, the bonding performance of low-sodium colloidal silica will be further improved and its application will be expanded.